Roughness of Hole Wall

The photographs below show some very rough holes caused by drilling.
This defect should be controlled to satisfy the quality demanded.

Gouged resin part

"Tear-Out" glass cloth part

Drill Bit Design

Cause Failure condition Countermeasure
Small chip pocket (flute volume) Chip clogging causes increased roughness. Enlarge chip pocket volume, change web thickness web taper, and flute land ratio.
Short flute length and body length If swarf clogging occurring at the end of flute, it causes a rough finish. Set suitable flute length for stack height.
Unsuitable drill bit geometries (helix angle) A drill bit with a low helix angle (30-36 deg.) does not evacuate swarf smoothly, causing roughness Higher helix angle (40 - 45deg.)
Large margin length Increased area of contact between the drill bit surface and the hole wall raises drilling temperature causing roughness. Smaller margin width.
Unsuitable tungsten carbide material Increased wearing blunts the drill's cutting edges, causing roughens Use wear-resistant WC material.

Manufacture

Cause Failure condition Countermeasure
Excessive repointing amount Reduced flute volume causes swarf clogging and roughness of hole wall Control amount removed of material at repoint (0.05-0.10mm). Check overall length of repoint drill bit.

Drilling Condition

Cause Failure condition Countermeasure
High chipload High chipload drilling increases the volume of chips, making it hard to evacuate, causing a rough finish. It is also possible that a damaged cutting edge can influence roughness of hole wall. Apply suitable chipload. (Please refer to drilling parameters.)
Low chipload Low chipload promotes wearing, and causes a rough finish.
Unsuitable pec drilling If the number of steps and the amount of feed don't match the PCB setup, it worsens swarf evacuation and causes a rough finish. Recalculate pec drilling step increments/parameters
Penetrating to deep into the backup board Materials such as Backing Board generate large particles of swarf which can adhere to the drill causing Bird Nesting. Apply suitable penetration depth.

PCB Setting

Cause Failure condition Countermeasure
Panel stack height to high Large volume of chips causes Swarf clogging Lower chipload. Decrease PCB stack height.
Hinge number and thickness of PCB copper layers Spiral Copper chip form blocks chip evacuation and high copper content causes wearing. Lower chipload. Use a type which has enough chip pocket to promote good roughness of hole wall
Thick and few layers PCB (Example t1.6, D/S) Likely to have grubbed and rough finish. Lower chipload. Use a type which has enough chip pocket to promote good roughness of hole wall
Hard cutting PCB material The increase of cutting resistance causes wear and worsens accuracy. Decrease PCB stack heights and reduce hit count to minimize drill bit damage.
Unsuitable entry board Using aluminum entry board, fine roughness of hole wall can not always be expected. The lubricant type offers better comparability for fine hole wall condition Use high quality entry board like attached water soluble resin type, multi-layer aluminum type, etc.
Unsuitable Stack preparation A gap between the entry board and PCB causes poor chip evacuation. Prepare stack with no gaps between entry board and PCB
PCB qualities Uneven resin and fiber intersections worsen roughness of hole wall Check PCB quality. Example: Check unevenness of PCB using an image processor/AOI machine for measuring hole positioning accuracy. ---> An extreme striped pattern, etc.

Equipment

Cause Failure condition Countermeasure
Unsuitable Vacuum force Low vacuum force worsens chip evacuation, and causes rough hole wall. Set suitable vacuum force. (Recommended value: 0.4dia. 100-150 hPa, 0.1dia. 70-140 hPa) Maintain dust catcher system of the drilling machine.
Unsuitable force of pressure foot A wider inner bush cause poor chip evacuation and roughness of hole wall. Using small inner diameter bush. Example: Change from 10mm to 3mm inner dia.

PRODUCT 01 PCB Drills / Routers / Ultra precision micro-hole drill

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