PCB material
CEM-3
|
Maximum Spindle Speed
|
Layer counts |
| Double sided | |
| 200k | (Page2, 137KB) |
| 160k | (Page2, 137KB) |
| 125k | (Page2, 137KB) |
| 100k | (Page2, 137KB) |
Package substrate
|
Maximum Spindle Speed
|
Layer counts |
| Double sided & 4-layer | |
| 300k | (Page1, 137KB) |
| 200k | (Page2, 146KB) |
| 160k | (Page2, 146KB) |
| 125k | (Page2, 146KB) |
High multilayer PWB
|
Maximum Spindle Speed
|
Layer counts |
| 10-layer and above | |
| 200k | (Page2, 139KB) |
| 160k | (Page2, 139KB) |
| 125k | (Page2, 139KB) |
| 100k | (Page2, 139KB) |
