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Resin Smearing

Resin is melted by the drilling heat, and attaches to the inner or outer copper layers.
 
 
 
 
Cause Failure condition Countermeasure
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ST Type Increased area of contact between the drill bit surface and hole wall raises drilling temperature. UC type
Large margin width Increased area of contact between the drill bit surface and the hole wall raises drilling temperature. Select suitable margin length.
Small chip pocket Low swarf evacuation causes the resin to attach to the inner copper layers in then hole wall. Smaller chip pocket
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Repointed drill bit which has excessive diameter wearing at the drill tip. Increased drilling temperature causes smear. Check wearing condition. Repointing must remove correct amount to return full diameter.
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Low chipload and hit count to high Low chipload promotes wearing, and causes smear. Higher chipload
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Low glass transition temperature (Tg) If the drilling temperature approaches or exceeds Tg, causes smear. Use Hi-Tg material.
Hinge number and thickness of PWB copper layers High cutting resistance increases drilling temperature, causing smear. Decrease PWB stack heights and hit count to reduce drill bit damage. Use double drilling method.
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Non desmearing Remaining smear. Desmear treatment
 
 

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