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Techical Database

Swarf Clogging

Poor swarf evacuation will make swarf stop in the drilled hole and any space between the PCB and entry board.
 
*Pictures of the exit side of some entry board
(Non swarf clogging)
(Swarf clogging)
 
 
Cause Failure condition Countermeasure
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Small chip pocket (flute volume) Poor chip evacuation causes clogging. Enlarge chip pocket volume, change web thickness web taper, and flute land ratio.
Short flute length Poor chip evacuation at near the end of flute causes clogging. Apply suitable flute length for stack height.
Small helix angle Poor chip evacuation in flute causes clogging. Higher helix angle.
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High chipload High Infeed rate does not allow the chip to evacuate properly Lower chipload.
Penetrating to deep into the backup board Materials such as Backing Board generate large particles of swarf which can adhere to the drill causing Bird Nesting. Set suitable penetration depth.
No dwell time between drilling strokes Bird Nesting occurs because the drill has not completed the evacuation process Use dwell time.

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Hinge number and thickness of PWB copper layers Spiral copper chips prevent good chip evacuation Higher chipload
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Unsuitable bush diameter (entry board lifts) The chip/swarf penetrates the gap between the top board and the entry board Control spindle run out (maintenance and repair). Recommended value <10 micron (<5 micron is better for <0.3mm drill bits)
Unsuitable vacuum force Both a low vacuum force and an excessive vacuum force worsens chip evacuation. Set suitable vacuum force. (Recommended value: 0.4dia. 100-150 hPa, 0.1dia. 70-140 hPa) Maintain dust catcher system of the drilling machine.
 
 

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